TT Electronics/IRC

GS4B013922JT

GS4B013922JT Description

The GS4B013922JT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision surface-mount applications. This ceramic-based thin-film resistor network offers a 39.2KΩ resistance per element with a ±5% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide operating range of 70°C to 125°C. The SOIC-C series construction provides excellent thermal and mechanical stability, making it suitable for demanding environments. With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this component is engineered for reliability in compact circuit designs.

GS4B013922JT Features

• Bussed Network Design: Simplifies PCB layout by integrating multiple resistors into a single package.
• High-Temperature Stability: Operates reliably up to 125°C with derated power handling.
• Precision Thin-Film Technology: Delivers low TCR (±100ppm/°C) and tight tolerance (±5%).
• Robust Ceramic Case: Enhances durability and heat dissipation in harsh conditions.
• Gull Wing Termination: Ensures secure surface mounting with a 1.27mm terminal pitch.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications where PPAP compliance is not required.

GS4B013922JT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision resistance matching for signal conditioning.
• Analog Signal Processing: Stable performance in op-amp feedback networks.
• Industrial Control Systems: Reliable operation in high-temperature environments.
• Test & Measurement Equipment: Low-drift resistance for calibration circuits.
• Power Management Modules: Efficient current distribution in compact designs.

Conclusion of GS4B013922JT

The GS4B013922JT combines space-saving integration, thermal resilience, and electrical precision, making it a superior choice for engineers designing high-density PCBs. Its ceramic SOIC package and thin-film technology offer a competitive edge over bulkier or less stable alternatives. While not RoHS-compliant, its robust construction and wide temperature range cater to industrial and instrumentation applications where durability is critical. For projects requiring bussed resistor networks with consistent performance, this model delivers an optimal balance of size, power handling, and reliability.