TT Electronics/IRC

GS4B014122JFT

GS4B014122JFT Description

The GS4B014122JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 41.2KΩ resistance per element and a ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for thermally challenging circuits. The SOIC-C series construction features gull-wing terminations for secure surface-mount assembly, while the 0.05W (1/20) power rating per resistor and 100V maximum voltage rating ensure durability in low-power signal conditioning.

GS4B014122JFT Features

• Ceramic substrate for enhanced thermal stability and mechanical robustness.
• Bussed topology (BUS) simplifies circuit design by interconnecting resistors.
• Thin-film technology delivers superior accuracy (±5%) and low TCR (±100ppm/°C).
• Compact SOIC package (4.9mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm length/height).
• 1.27mm terminal pitch for compatibility with automated PCB assembly.
• Non-automotive (PPAP: No) but ideal for industrial and telecom applications.
• Tube packaging for safe handling and storage.

GS4B014122JFT Applications

This resistor network excels in:

• Voltage dividers and pull-up/down circuits in embedded systems.
• Signal conditioning for sensors and data acquisition modules.
• Industrial control systems requiring stable resistance under thermal stress.
• Telecommunications equipment where space-efficient, high-reliability components are critical.
• Test and measurement devices leveraging its tight ratio tolerance (±1%).

Conclusion of GS4B014122JFT

The GS4B014122JFT combines precision, compactness, and thermal resilience, making it a standout choice for engineers designing high-density PCBs or systems exposed to wide temperature ranges. While not RoHS-compliant, its ceramic construction and thin-film technology offer long-term reliability in industrial and telecom applications. For projects demanding bussed networks with low TCR and robust packaging, this model delivers exceptional value.