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GS4B0144R2JFT
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GS4B0144R2JFT Description
GS4B0144R2JFT Description
The GS4B0144R2JFT from TT Electronics/IRC is a high-reliability 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable performance under varying thermal conditions. Constructed with ceramic substrate and thin-film technology, it delivers a 44.2Ω resistance per element with a ±5% absolute tolerance and ±1% ratio tolerance, ensuring consistent signal integrity. The network operates across a wide temperature range (-70°C to +125°C) with a ±100ppm/°C temperature coefficient, making it suitable for environments with thermal fluctuations. Its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating provide robust performance in compact designs.
GS4B0144R2JFT Features
- Ceramic Case & Thin Film Technology: Enhances thermal stability and long-term reliability.
- Bussed Network (BUS Designator): Simplifies PCB layout by connecting resistors in a common configuration.
- Precision Tolerances: ±5% absolute and ±1% ratio tolerance for critical analog/digital circuits.
- High-Temp Operation: Rated for 125°C with derated power up to 70°C–125°C.
- Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with gull-wing leads for easy surface mounting.
- Low TCR (±100ppm/°C): Minimizes resistance drift in temperature-sensitive applications.
GS4B0144R2JFT Applications
- Voltage Division & Pull-Up/Down Networks: Ideal for microcontroller I/O interfaces.
- Automotive & Industrial Electronics: Despite non-automotive PPAP status, its wide temp range suits harsh environments.
- Signal Conditioning: Used in ADC/DAC circuits, sensor interfaces, and precision instrumentation.
- Power Management: Distributed load balancing in low-power DC/DC converters.
- Consumer Electronics: Space-constrained designs like wearables or IoT devices benefit from its high-density integration.
Conclusion of GS4B0144R2JFT
The GS4B0144R2JFT excels in applications demanding stable resistance values under thermal stress, offering a blend of precision, compactness, and durability. Its ceramic construction and thin-film resistors provide superior performance over polymer-based networks, while the bussed design reduces component count. Though not RoHS-compliant, it remains a cost-effective choice for industrial and embedded systems where reliability outweighs regulatory constraints. Engineers will appreciate its balance of electrical robustness and mechanical resilience in critical circuits.



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