TT Electronics/IRC

GS4B014641BAT

GS4B014641BAT Description

The GS4B014641BAT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for demanding surface-mount applications. This thin-film resistor network offers a 4.64KΩ resistance per element with an exceptional ±0.1% absolute tolerance and ±0.05% ratio tolerance, ensuring superior accuracy in signal conditioning and voltage division circuits. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for stable performance across a wide thermal range. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating further enhance its reliability in precision analog and digital systems.

GS4B014641BAT Features

• Ceramic SOIC Package: Robust rectangular ceramic case (4.9mm x 5.99mm x 1.45mm) with gull-wing termination for secure surface mounting.
• High Precision: ±0.1% tolerance and ±100ppm/°C TCR for critical applications requiring minimal drift.
• Bussed Network Design: Simplifies PCB layout with 7 resistors connected to a common bus, reducing component count.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, ideal for industrial and automotive environments (though not PPAP/automotive-qualified).
• Thin-Film Technology: Delivers low noise and stable performance over time compared to thick-film alternatives.

GS4B014641BAT Applications

• Precision Voltage Dividers: Ideal for ADC/DAC reference circuits and sensor signal conditioning.
• Industrial Control Systems: Suitable for PLCs, instrumentation, and test equipment due to its low tolerance and thermal stability.
• Telecommunications: Used in filtering and impedance matching networks where consistency is critical.
• Medical Electronics: Reliable performance in diagnostic devices requiring high accuracy.

Conclusion of GS4B014641BAT

The GS4B014641BAT stands out for its ceramic construction, tight tolerances, and bussed architecture, making it a top choice for engineers prioritizing precision and durability. While not automotive-grade, its thin-film technology and wide operational range cater to industrial, medical, and telecom applications where component reliability is non-negotiable. Its SOIC footprint ensures compatibility with standard assembly processes, offering a balance of performance and manufacturability.