TT Electronics/IRC

GS4B014751GDT

GS4B014751GDT Description

The GS4B014751GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 4.75KΩ resistance per element with a tight ±2% absolute tolerance and ±0.5% ratio tolerance, ensuring consistent performance in matched-resistor circuits. Its thin-film technology delivers excellent stability, with a low ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The network operates over a wide temperature range of -70°C to +125°C, derated for power at elevated temperatures, and supports a maximum voltage rating of 100V.

GS4B014751GDT Features

• Ceramic Construction: Enhances thermal and mechanical durability, ideal for harsh environments.
• Bussed Design (BUS): Simplifies circuit layout by connecting resistors in a common configuration.
• High Power Handling: 0.4W total power rating (0.05W per resistor) for robust performance.
• Precision Tolerance: ±2% absolute and ±0.5% ratio tolerance for critical analog/digital applications.
• Surface-Mount Gull Wing Terminals: Ensures reliable PCB mounting with a 1.27mm pitch.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.

GS4B014751GDT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance ensures accurate signal scaling.
• Sensor Interface Modules: Stable performance under thermal stress (e.g., industrial sensors).
• Communication Equipment: Reliable signal conditioning in RF and baseband systems.
• Test & Measurement Devices: Low TCR minimizes drift in calibration circuits.
• Power Management Systems: Bussed design simplifies bias networks in DC-DC converters.

Conclusion of GS4B014751GDT

The GS4B014751GDT combines ceramic ruggedness, thin-film precision, and compact SOIC packaging to address demanding circuit design challenges. Its bussed architecture reduces component count, while tight tolerances enhance signal integrity. Though not RoHS-compliant, it remains a top choice for non-consumer applications requiring durability and accuracy. Ideal for engineers prioritizing thermal stability, space efficiency, and simplified routing in industrial and telecom systems.