TT Electronics/IRC

GS4B0147R0JDT

GS4B0147R0JDT Description

The GS4B0147R0JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 47Ω resistance value (±5% tolerance) and ±100ppm/°C temperature coefficient, it ensures reliable performance across a wide temperature range (70°C to 125°C). The ceramic case and SOIC-C series construction provide excellent thermal stability and mechanical durability, while the gull-wing termination facilitates easy surface-mount assembly. Rated for 0.05W per resistor (0.4W total power dissipation) and 100V maximum voltage, this network is engineered for efficiency in compact PCB designs.

GS4B0147R0JDT Features

• Bussed Network Design: 7 resistors connected in a bus configuration, simplifying circuit layout for common voltage-divider or pull-up/down applications.
• High Precision: ±5% absolute tolerance and ±0.5% ratio tolerance ensure consistent performance in matched-resistor applications.
• Robust Construction: Ceramic substrate and thin-film technology deliver superior thermal and long-term stability.
• Space-Efficient: Compact SOIC package (4.9mm × 5.99mm × 1.45mm) with 1.27mm terminal pitch, ideal for high-density PCBs.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive environments (though not PPAP/automotive-certified).

GS4B0147R0JDT Applications

• Voltage Division: Precision dividers in sensor interfaces or ADC/DAC circuits.
• Pull-Up/Down Networks: Signal conditioning in digital logic (e.g., I²C buses).
• Industrial Controls: Stable resistance in harsh environments (e.g., motor drives, power supplies).
• Consumer Electronics: Space-constrained designs requiring reliable thin-film networks (e.g., wearables, IoT devices).

Conclusion of GS4B0147R0JDT

The GS4B0147R0JDT combines precision, durability, and compactness, making it a standout choice for engineers needing a bussed resistor network with tight tolerances and robust thermal performance. Its ceramic SOIC package and thin-film technology offer advantages over cheaper thick-film alternatives, particularly in applications demanding long-term stability and minimal drift. While not automotive-grade, its 125°C rating and low TCR (±100ppm/°C) make it versatile for industrial, consumer, and instrumentation designs.