


TT Electronics/IRC
GS4B015101CT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B015101CT Description
GS4B015101CT Description
The GS4B015101CT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. Featuring a 5.1KΩ resistance per element with an ultra-tight ±0.25% tolerance, this ceramic-based thin-film network ensures exceptional stability and accuracy. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with thermal fluctuations. The SOIC-C series construction offers robust performance with a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, housed in a compact 4.9mm × 5.99mm × 1.45mm footprint.
GS4B015101CT Features
- Precision Performance: Thin-film technology with ±0.25% absolute tolerance for critical analog/digital circuits.
- Thermal Reliability: Stable ±100ppm/°C TCR and derated power up to 125°C.
- Space-Efficient Design: 8-pin SOIC (Narrow) with 1.27mm terminal pitch, ideal for high-density PCBs.
- Robust Construction: Ceramic case ensures durability and low thermal resistance.
- Bussed Configuration: Simplified routing for common voltage distribution or pull-up/down networks.
- Non-Automotive/Non-PPAP: Optimized for industrial, telecom, and instrumentation use.
GS4B015101CT Applications
- Voltage Divider Networks: Precision attenuation in sensor interfaces or ADCs.
- Pull-Up/Pull-Down Arrays: Signal conditioning in digital logic (e.g., I²C, SPI buses).
- Industrial Controls: Stable resistance in PLCs, motor drivers, and power management.
- Test & Measurement Equipment: High-accuracy circuits for calibration or feedback loops.
- Telecom Infrastructure: Signal integrity in RF modules or baseband processing.
Conclusion of GS4B015101CT
The GS4B015101CT excels in applications requiring tight tolerance, thermal stability, and compact integration. Its ceramic thin-film design and bussed architecture reduce component count while ensuring reliability in industrial and communication systems. Though not PPAP-capable or automotive-grade, it offers a cost-effective solution for precision networks where space and performance are critical. Engineers will value its balance of accuracy, power handling, and footprint efficiency.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










