TT Electronics/IRC

GS4B0156R0GGT

GS4B0156R0GGT Description

The GS4B0156R0GGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable resistance values. Built with ceramic substrate and thin-film technology, it offers a 56Ω resistance per element with a tight ±2% absolute tolerance and ±2% ratio tolerance. The device operates over a wide temperature range (-70°C to +125°C) with a low ±100ppm/°C temperature coefficient, ensuring minimal drift in harsh environments. Rated for 100V maximum voltage and 0.4W total power dissipation, it combines reliability with compact surface-mount (SOIC) packaging (4.9mm x 5.99mm x 1.45mm).

GS4B0156R0GGT Features

• Bussed Network Design: 7 resistors connected in a common bus configuration, simplifying PCB layout for shared voltage/current paths.
• High Stability: Ceramic case and thin-film construction provide excellent thermal and long-term stability.
• Precision Performance: ±2% tolerance and ±100ppm/°C TCR ensure consistent performance in precision circuits.
• Robust Packaging: Narrow SOIC (8-pin) with gull-wing leads for reliable surface-mount assembly.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive (non-AEC-Q) applications.
• Non-RoHS Compliant: Ideal for legacy or specialized designs requiring traditional materials.

GS4B0156R0GGT Applications

• Voltage Divider Networks: Precision dividers in sensor interfaces or ADC reference circuits.
• Bus Termination: Signal integrity in high-speed digital systems (e.g., memory buses).
• Industrial Controls: Stable resistance in PLCs, motor drives, and power management.
• Test & Measurement Equipment: Low-drift networks for calibration or signal conditioning.
• Legacy Electronics: Non-RoHS compliant designs requiring ceramic-based reliability.

Conclusion of GS4B0156R0GGT

The GS4B0156R0GGT excels in applications demanding tight tolerance, low TCR, and robust packaging. Its bussed architecture reduces component count, while ceramic/thin-film construction ensures durability. Though not automotive-grade, it suits industrial, instrumentation, and high-reliability systems where stability and compactness are critical. Engineers will value its balance of precision and power handling in space-constrained designs.