TT Electronics/IRC

GS4B016040GFT

GS4B016040GFT Description

The GS4B016040GFT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding electronic circuits. Housed in an 8-pin narrow SOIC (SOIC-C) ceramic package, this thin-film resistor network offers a 604Ω resistance per element with a tight ±2% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in matched impedance applications. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for stable operation across industrial and automotive environments. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating further enhance its reliability in high-density PCB designs.

GS4B016040GFT Features

• Ceramic Case & Thin Film Technology: Delivers superior thermal stability and low noise, ideal for precision analog circuits.
• Bussed Network (BUS Design): Simplifies circuit layout by connecting resistors in a common configuration, reducing component count.
• Narrow SOIC Package (4.9mm × 5.99mm): Space-saving footprint with 1.27mm terminal pitch for high-density SMT assembly.
• Wide Temperature Range: Operates from 70°C to 125°C @ derated power, ensuring performance in thermally challenging environments.
• Robust Construction: Gull-wing termination and ±0.1mm height tolerance facilitate reliable soldering and mechanical durability.

GS4B016040GFT Applications

• Voltage Divider Networks: Precision signal conditioning in sensor interfaces and ADC/DAC circuits.
• Bus Termination & Pull-Up/Pull-Down Arrays: Ensures signal integrity in high-speed digital systems (e.g., I²C, SPI).
• Industrial Control Systems: Stable performance in PLCs, motor drives, and power management modules.
• Automotive Electronics: Suitable for non-safety-critical applications like infotainment or lighting control (note: not PPAP/AEC-Q200 qualified).

Conclusion of GS4B016040GFT

The GS4B016040GFT excels in applications requiring matched resistance values, compact packaging, and thermal resilience. Its ceramic SOIC construction and thin-film technology provide a competitive edge over polymer-based networks, particularly in environments with fluctuating temperatures. While not automotive-grade, its 2% tolerance and low TCR make it a cost-effective choice for industrial and consumer electronics where precision and space efficiency are critical. Engineers should verify compliance with EU RoHS for specific regulatory needs.