TT Electronics/IRC

GS4B0160R4JDT

GS4B0160R4JDT Description

The GS4B0160R4JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable resistance values under varying conditions. Built with ceramic substrate and thin-film technology, it offers excellent thermal stability with a ±100ppm/°C temperature coefficient. The network features a 60.4Ω resistance per element with a ±5% absolute tolerance and ±0.5% ratio tolerance, ensuring tight matching for differential signaling or voltage division. Rated for 0.05W (1/20W) per resistor and 0.4W total power dissipation, it operates reliably from 70°C to 125°C with a 100V maximum voltage rating. Its gull-wing termination and surface-mount design facilitate automated PCB assembly.

GS4B0160R4JDT Features

• Bussed Network: 7 resistors connected in a common-bus configuration, simplifying circuit design.
• High Stability: Ceramic case and thin-film construction ensure minimal drift under thermal stress.
• Precision Tolerance: ±5% absolute, ±0.5% ratio tolerance for matched performance.
• Robust Packaging: 8-pin SOIC (4.9mm × 5.99mm × 1.45mm) with ±0.1mm dimensional tolerances.
• Wide Operating Range: -70°C to +125°C derated power range, ideal for harsh environments.
• Low TCR: ±100ppm/°C reduces resistance variation with temperature.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch enable high-speed SMT placement.

GS4B0160R4JDT Applications

• Voltage Dividers: Precision ratio tolerance suits ADC reference networks.
• Bus Termination: Low-inductance design for high-speed digital lines (e.g., DDR, PCIe).
• Industrial Controls: Stable performance in PLCs, motor drives, and sensor interfaces.
• Automotive Electronics: Despite non-AECQ qualification, usable in non-safety-critical modules like infotainment.
• Test Equipment: Reliable resistance matching for calibration circuits.

Conclusion of GS4B0160R4JDT

The GS4B0160R4JDT excels in applications demanding tight tolerance, thermal stability, and compact integration. Its ceramic SOIC package outperforms epoxy-based networks in high-temperature environments, while the bussed topology reduces component count. While not PPAP-capable or automotive-grade, it remains a cost-effective choice for industrial, telecom, and instrumentation designs where precision and reliability are critical. Engineers should verify RoHS compliance for specific regulatory needs.