TT Electronics/IRC

GS4B016192JFT

GS4B016192JFT Description

The GS4B016192JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding electronic circuits. Encased in a narrow SOIC (SOIC-C) ceramic package, this thin-film resistor network offers a 61.9KΩ resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±1%, ensuring consistent performance in matched-resistor applications. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with thermal fluctuations. The 8-pin gull-wing termination enables reliable surface-mount (SMD) assembly, while the 0.4W total power rating (0.05W per resistor) balances compactness with robust power handling.

GS4B016192JFT Features

• Ceramic Case & Thin Film Technology: Enhances thermal stability and durability in harsh conditions.
• Bussed Network (BUS Designator): Simplifies circuit design by interconnecting resistors, reducing PCB footprint.
• Precision Tolerance: ±5% absolute and ±1% ratio tolerance for high-accuracy signal conditioning.
• Wide Voltage Rating: Supports up to 100V, ideal for industrial and automotive (non-AEC-Q200) applications.
• Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.

GS4B016192JFT Applications

• Voltage Dividers & Signal Conditioning: Precision networks in ADCs/DACs or sensor interfaces.
• Industrial Control Systems: Stable performance in PLCs, motor drives, and power supplies.
• Telecom Infrastructure: Impedance matching and filtering in RF modules.
• Test & Measurement Equipment: Reliable resistance matching for calibration circuits.
• Non-Automotive Embedded Systems: Where EU RoHS compliance is not critical.

Conclusion of GS4B016192JFT

The GS4B016192JFT excels in space-constrained, precision applications requiring thermal resilience and tight tolerance matching. Its ceramic SOIC package and bussed architecture offer a superior alternative to discrete resistors, streamlining PCB design. While not automotive-grade, it is a cost-effective solution for industrial, telecom, and instrumentation markets. Engineers will value its balance of performance, compactness, and reliability in critical circuits.