TT Electronics/IRC

GS4B0163R4GGT

GS4B0163R4GGT Description

The GS4B0163R4GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 7-resistor bussed network is housed in an 8-pin narrow SOIC package, offering a compact footprint (4.9mm × 5.99mm × 1.45mm) with ±0.1mm length/height tolerances for reliable PCB integration. Featuring a 63.4Ω resistance per element with a tight ±2% absolute tolerance, it ensures consistent performance in voltage division, pull-up/pull-down, and bus termination applications. The thin-film technology and ceramic case provide excellent thermal stability, with a ±100ppm/°C temperature coefficient and 125°C maximum operating temperature. Rated for 100V maximum voltage and 0.4W total power dissipation, it balances durability with efficiency.

GS4B0163R4GGT Features

• Bussed Network Design: 7 resistors connected in a bus configuration, simplifying circuit layout for shared-voltage applications.
• High Precision: ±2% tolerance on both absolute and ratio values, critical for matched impedance and signal integrity.
• Robust Construction: Ceramic substrate and gull-wing termination ensure mechanical strength and solderability.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, suitable for industrial environments.
• Low TCR: ±100ppm/°C minimizes resistance drift under thermal stress.
• Surface-Mount Compatibility: SOIC package (1.27mm pitch) aligns with automated assembly processes.

GS4B0163R4GGT Applications

• Voltage Dividers: Precision reference circuits in ADCs/DACs.
• Bus Termination: Impedance matching in high-speed digital systems (e.g., memory buses).
• Pull-Up/Down Networks: Stabilizing logic levels in microcontrollers and FPGAs.
• Industrial Controls: Sensor interfaces and power management where thermal stability is critical.
• Automotive (Non-Automotive Rated): Prototyping or non-safety-critical systems requiring tight tolerance.

Conclusion of GS4B0163R4GGT

The GS4B0163R4GGT excels in applications demanding precision, thermal resilience, and space efficiency. Its ceramic thin-film construction and bussed topology reduce component count while maintaining performance, making it ideal for dense PCBs and signal-conditioning circuits. Though not PPAP or automotive-qualified, its 2% tolerance and low TCR outperform generic arrays in stability-critical designs. Engineers will value its balance of compactness, reliability, and cost-effectiveness for industrial and communication systems.