TT Electronics/IRC

GS4B016491DBT

GS4B016491DBT Description

The GS4B016491DBT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor BUS-configuration array offers a 6.49KΩ resistance per element with an ultra-tight ±0.5% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of 70°C to 125°C. Housed in a ceramic SOIC-8 package, it features gull-wing SMD terminations for reliable surface-mount assembly. With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is engineered for precision analog and digital circuits where space efficiency and accuracy are critical.

GS4B016491DBT Features

• High Precision: ±0.5% tolerance and ±100ppm/°C TCR for stable performance.
• Robust Construction: Ceramic substrate ensures durability and thermal stability.
• Space-Saving Design: Compact 4.9mm × 5.99mm × 1.45mm SOIC package ideal for dense PCB layouts.
• Optimized Power Handling: 0.4W total dissipation (0.05W per resistor) with derating up to 125°C.
• Automated Assembly Friendly: Gull-wing terminations and 1.27mm pitch for compatibility with pick-and-place systems.
• Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and instrumentation applications.

GS4B016491DBT Applications

This resistor network excels in:

• Precision Voltage Dividers: Critical in ADC/DAC reference circuits.
• Signal Conditioning: For sensors and measurement equipment requiring low drift.
• Bus Termination Networks: High-speed data lines (e.g., CAN, SPI) where impedance matching is vital.
• Industrial Control Systems: PLCs and motor drives benefiting from its ceramic substrate’s thermal resilience.
• Medical Electronics: Diagnostic devices demanding long-term stability.

Conclusion of GS4B016491DBT

The GS4B016491DBT combines thin-film accuracy, ceramic reliability, and compact SMD packaging to address precision circuit design challenges. Its low TCR, tight tolerance, and robust power handling make it superior to generic thick-film networks in environments with thermal or electrical stress. While not PPAP-capable, it is a cost-effective solution for industrial and telecom applications where performance consistency is paramount. Engineers will value its balance of precision, durability, and space efficiency in high-density designs.