TT Electronics/IRC

GS4B016801DCT

GS4B016801DCT Description

The GS4B016801DCT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor array features a 6.8KΩ resistance per element with a tight 0.5% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of -70°C to +125°C. Housed in an 8-pin SOIC (Ceramic) package with gull-wing SMD termination, it offers excellent thermal and mechanical reliability. The device supports a maximum voltage rating of 100V and delivers a total power rating of 0.4W (0.05W per resistor), making it suitable for precision analog and digital circuits.

GS4B016801DCT Features

• Precision Thin Film Technology: Delivers high accuracy (±0.5%) and low TCR (±100ppm/°C) for stable performance.
• Robust Ceramic Package: Ensures superior thermal conductivity and durability in harsh environments.
• Compact SOIC-8 Form Factor: Space-saving 4.9mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances.
• BUS Circuit Design: Optimized for bus termination, voltage division, and pull-up/down applications.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power handling.
• Gull-Wing SMD Termination: Facilitates automated PCB assembly and strong solder joint integrity.

GS4B016801DCT Applications

Ideal for precision instrumentation, medical devices, industrial controls, and automotive subsystems (though not PPAP/AEC-Q200 qualified), this resistor network excels in:

• Voltage Reference Circuits: Stable dividers for ADCs/DACs.
• Signal Conditioning: Impedance matching in high-speed data lines.
• Bus Termination Networks: Damping reflections in DDR, PCIe, or CAN bus designs.
• Embedded Systems: Pull-up/down arrays for microcontrollers and FPGAs.

Conclusion of GS4B016801DCT

The GS4B016801DCT combines precision, compactness, and ruggedness, making it a top choice for engineers needing reliable resistor networks in critical analog/digital designs. Its ceramic construction, low TCR, and tight tolerance outperform plastic-encapsulated alternatives, particularly in thermal stress scenarios. While not automotive-grade, it is well-suited for industrial, telecom, and test equipment where accuracy and longevity are paramount.