TT Electronics/IRC

GS4B016802JT

GS4B016802JT Description

The GS4B016802JT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for precision surface-mount applications. It features a 68 kΩ resistance value per element with a ±5% tolerance and a ±100 ppm/°C temperature coefficient, ensuring stable performance across a 70°C to 125°C derated power range. The thin-film technology provides superior accuracy and reliability, while the 0.05W (1/20W) power rating per resistor and 0.4W total power rating make it suitable for low-power circuits. With a 100V maximum voltage rating, gull-wing termination, and 1.27mm terminal pitch, this network is optimized for automated PCB assembly.

GS4B016802JT Features

• Ceramic SOIC-C package for enhanced thermal stability and durability.
• Bussed (BUS) circuit design simplifies routing in multi-resistor applications.
• 7 resistors in an 8-pin configuration with ±0.1mm length/height tolerances for precise placement.
• Thin-film technology ensures low noise and high accuracy (±5%).
• Wide operating temperature range (-55°C to +125°C) with derating up to 125°C.
• RoHS non-compliant (contains lead), suitable for legacy or industrial systems.
• Tube packaging for secure handling and storage.

GS4B016802JT Applications

Ideal for analog signal conditioning, voltage division, and pull-up/pull-down networks in:

• Industrial control systems requiring stable resistance under thermal stress.
• Automotive electronics (non-AECQ qualified; suitable for non-safety-critical circuits).
• Medical devices where precision and repeatability are critical.
• Telecom infrastructure for impedance matching and termination.
• Legacy equipment maintenance due to its robust ceramic construction.

Conclusion of GS4B016802JT

The GS4B016802JT excels in high-reliability environments where thermal stability, space efficiency, and consistent performance are paramount. Its ceramic SOIC package and thin-film resistors offer superior durability compared to polymer-based networks, while the bussed design reduces PCB complexity. Though not PPAP or automotive-grade, it is a cost-effective solution for industrial, medical, and telecom applications demanding precision and longevity.