TT Electronics/IRC

GS4B017152JFT

GS4B017152JFT Description

The GS4B017152JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 8-pin Narrow SOIC (SOIC-C Series) component features 7 bussed resistors with a 71.5KΩ resistance value and a ±5% absolute tolerance, ensuring reliable signal integrity. Its thin-film technology delivers stable performance with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The network operates within a wide temperature range of 70°C to 125°C and supports a maximum voltage rating of 100V, with a power rating of 0.4W (0.05W per resistor). Encased in a rectangular ceramic package, it offers excellent durability and thermal dissipation.

GS4B017152JFT Features

• Bussed Circuit Design: Simplifies PCB layout by connecting multiple resistors in a single package.
• High-Temperature Stability: Operates reliably up to 125°C with derated power up to 70°C.
• Precision Thin Film: Ensures low noise and tight ±1% ratio tolerance for matched resistance values.
• Robust Construction: Ceramic case enhances thermal and mechanical resilience.
• Surface-Mount Gull Wing Terminals: Facilitates automated assembly with a 1.27mm pitch.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications.

GS4B017152JFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision attenuation in sensor interfaces.
• Signal Conditioning: Stable performance in ADC/DAC reference networks.
• Industrial Control Systems: Reliable operation in harsh environments (e.g., PLCs, motor drives).
• Test & Measurement Equipment: Low-drift resistance for calibration modules.
• Consumer Electronics: Compact solution for space-constrained designs like wearables.

Conclusion of GS4B017152JFT

The GS4B017152JFT combines high precision, thermal stability, and compact packaging, making it a superior choice for engineers seeking reliability in bussed resistor networks. Its ceramic construction and thin-film technology outperform plastic-encased alternatives in high-temperature scenarios, while its SOIC footprint ensures compatibility with modern SMT processes. Ideal for industrial, commercial, and instrumentation applications, this component balances performance with cost efficiency.