TT Electronics/IRC

GS4B0171R5JGT

GS4B0171R5JGT Description

The GS4B0171R5JGT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding environments. Housed in an 8-pin narrow SOIC (SOIC-C) ceramic package, this thin-film resistor network offers a 71.5Ω resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±2%. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C. With a maximum voltage rating of 100V and a power rating of 0.4W (0.05W per resistor), it is engineered for reliability in compact, surface-mount designs.

GS4B0171R5JGT Features

• Ceramic Case & Thin Film Technology: Enhances thermal stability and durability, ideal for high-temperature environments.
• Bussed Network (BUS): Simplifies circuit design by interconnecting resistors, reducing component count.
• Precision Tolerance: ±5% absolute and ±2% ratio tolerance for consistent performance in matched circuits.
• Robust Construction: Gull-wing termination and SOIC package ensure secure PCB mounting and mechanical resilience.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive-adjacent applications (though not PPAP or Automotive qualified).
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).

GS4B0171R5JGT Applications

• Voltage Division & Pull-Up/Down Networks: Precision resistor networks in ADC/DAC circuits.
• Signal Conditioning: Stable performance in sensor interfaces and feedback loops.
• Industrial Controls: Reliable operation in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Low-drift resistance for calibration and instrumentation.
• Consumer Electronics: Space-constrained designs requiring high-density resistor arrays.

Conclusion of GS4B0171R5JGT

The GS4B0171R5JGT excels in applications demanding compact size, thermal stability, and precision resistance matching. Its ceramic SOIC package and thin-film technology provide superior performance over standard epoxy-based networks, while the bussed design simplifies PCB layout. Though not RoHS-compliant or automotive-grade, it remains a cost-effective solution for industrial and commercial electronics where reliability and space efficiency are critical. Engineers will appreciate its balance of tolerance accuracy, power handling, and rugged construction in harsh operating conditions.