TT Electronics/IRC

GS4B0173R2JT

GS4B0173R2JT Description

The GS4B0173R2JT from TT Electronics/IRC is a high-reliability 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable performance under varying conditions. Constructed with thin-film technology on a ceramic substrate, it offers a 73.2Ω resistance per element with a ±5% tolerance and a ±100ppm/°C temperature coefficient, ensuring consistent operation across a -70°C to +125°C range. The SOIC-C series features a compact 4.9mm × 5.99mm × 1.45mm footprint, gull-wing terminations, and a 0.4W total power rating (0.05W per resistor), making it suitable for space-constrained designs. Its 100V maximum voltage rating and non-automotive PPAP status cater to industrial and commercial applications.

GS4B0173R2JT Features

• Bussed Network Design: Simplifies circuit layout with shared connections, reducing component count.
• Ceramic Case & Thin Film: Enhances thermal stability and durability in harsh environments.
• Low TCR (±100ppm/°C): Minimizes resistance drift over temperature fluctuations.
• High Power Density: 0.4W total dissipation in a compact SOIC package.
• Precision Tolerance: ±5% absolute tolerance ensures consistent performance.
• RoHS Non-Compliant: Suitable for legacy or exempted applications.

GS4B0173R2JT Applications

Ideal for signal conditioning, voltage division, and pull-up/pull-down networks in:

• Industrial Control Systems: Where stable resistance under thermal stress is critical.
• Test & Measurement Equipment: Demanding low TCR and tight tolerance.
• Power Management Circuits: Leveraging its 100V rating for bus voltage monitoring.
• Legacy Electronics: Non-RoHS compliant designs requiring proven reliability.

Conclusion of GS4B0173R2JT

The GS4B0173R2JT excels in precision analog circuits requiring compact, high-stability resistor networks. Its ceramic construction, bussed topology, and wide temperature range make it a robust choice for industrial and instrumentation applications. While not suited for automotive use, its thin-film technology and SOIC packaging offer a competitive edge in reliability and space efficiency over thicker-film or discrete alternatives. Engineers will value its balance of performance, size, and cost in demanding environments.