TT Electronics/IRC

GS4B017682BAT

GS4B017682BAT Description

The GS4B017682BAT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for demanding surface-mount applications. It features a 76.8KΩ resistance value with an exceptional ±0.1% absolute tolerance and ±0.05% ratio tolerance, ensuring superior accuracy in signal conditioning and voltage division. The thin-film technology delivers stable performance with a ±100ppm/°C temperature coefficient, operating reliably from 70°C to 125°C (derated) and up to 125°C maximum. With a 100V maximum voltage rating and 0.4W total power dissipation, it balances precision with robustness. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration.

GS4B017682BAT Features

• Ceramic Case: Enhances thermal stability and durability in harsh environments.
• Bussed Network (BUS): Simplifies circuit design with shared common terminals.
• Ultra-Tight Tolerances: ±0.1% absolute and ±0.05% ratio tolerance for precision applications.
• Low TCR: ±100ppm/°C ensures minimal resistance drift over temperature.
• Surface-Mount SOIC Package: Compact 4.9mm × 5.99mm × 1.45mm footprint with ±0.1mm dimensional tolerances.
• High Voltage Rating: Supports up to 100V, suitable for industrial and automotive (non-PPAP) systems.
• Thin-Film Technology: Delivers low noise and long-term stability.

GS4B017682BAT Applications

Ideal for precision analog circuits, this resistor network excels in:

• Voltage Dividers: Critical in ADC/DAC reference circuits due to its ratio tolerance.
• Sensor Signal Conditioning: Stable performance in temperature-sensitive environments (e.g., medical devices).
• Industrial Controls: Reliable operation in PLCs and power management systems.
• Test & Measurement Equipment: High accuracy for calibration and instrumentation.
• Aerospace & Defense: Ceramic construction meets ruggedness requirements (though non-RoHS).

Conclusion of GS4B017682BAT

The GS4B017682BAT stands out for its precision, thermal resilience, and compact SOIC-C form factor, making it a top choice for engineers prioritizing accuracy in space-constrained designs. While not automotive-grade (PPAP) or RoHS-compliant, its thin-film ceramic construction and bussed architecture offer unmatched stability in industrial, aerospace, and high-reliability applications. For systems demanding sub-0.1% tolerance and low TCR, this network delivers exceptional performance where lesser components would falter.