TT Electronics/IRC

GS4B018060GFT

GS4B018060GFT Description

The GS4B018060GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 7-resistor bussed network features an 806Ω resistance value with a tight ±2% absolute tolerance and ±1% ratio tolerance, ensuring reliable signal integrity and minimal deviation. Encased in an 8-pin narrow SOIC (SOIC-C) package, it offers a compact footprint (4.9mm × 5.99mm × 1.45mm) with gull-wing terminations for robust surface-mount assembly. The thin-film technology delivers excellent stability, with a ±100ppm/°C temperature coefficient and a 0.4W total power rating (0.05W per resistor). Rated for 100V maximum voltage and 125°C operating temperature, it is ideal for environments requiring durability and precision.

GS4B018060GFT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed circuit design simplifies PCB layout in voltage-divider or pull-up/down applications.
• Low TCR (±100ppm/°C) ensures minimal resistance drift across the -70°C to +125°C derated range.
• Narrow SOIC package (1.27mm pitch) optimizes board space in high-density designs.
• Non-automotive grade with PPAP "No", suitable for industrial and consumer electronics.
• Non-RoHS compliant (contains lead), making it compatible with legacy systems.

GS4B018060GFT Applications

This resistor network excels in:

• Analog signal conditioning (e.g., sensor interfaces, ADC/DAC circuits).
• Voltage division networks in power management ICs.
• Pull-up/down resistor arrays for microcontrollers and FPGAs.
• Industrial control systems requiring stable performance under thermal stress.
• Legacy electronics where leaded components are mandated.

Conclusion of GS4B018060GFT

The GS4B018060GFT stands out for its ceramic construction, precision tolerances, and compact SOIC footprint, offering engineers a reliable solution for space-constrained, high-stability designs. While not suited for automotive or RoHS-compliant applications, its thin-film technology and bussed architecture make it a top choice for industrial, instrumentation, and legacy systems demanding consistent performance across temperature extremes.