TT Electronics/IRC

GS4B018060JFT

GS4B018060JFT Description

The GS4B018060JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 8-pin Narrow SOIC package features 7 bussed resistors with a 806Ω resistance value, offering a ±5% absolute tolerance and ±1% ratio tolerance for consistent performance. Built with thin-film technology, it delivers excellent stability with a ±100ppm/°C temperature coefficient, ensuring reliable operation across a wide temperature range of -55°C to +125°C. The SOIC-C series construction provides robust mechanical durability, while the gull-wing termination enables secure surface-mount (SMD) assembly.

GS4B018060JFT Features

• Ceramic Case & Thin Film Technology: Ensures high thermal stability and low noise, ideal for precision analog/digital circuits.
• Bussed Network (7 Resistors): Simplifies PCB layout by reducing discrete component count.
• 806Ω ±5% Tolerance: Balanced resistance for voltage division, pull-up/down, and termination applications.
• Wide Operating Range: Supports -55°C to +125°C with derated power up to 70°C–125°C.
• Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• High Voltage Rating: 100V maximum for industrial-grade reliability.
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.

GS4B018060JFT Applications

• Voltage Dividers & Signal Conditioning: Precision attenuation in sensor interfaces.
• Pull-Up/Pull-Down Networks: Digital logic circuits (e.g., I²C, SPI buses).
• Termination Resistor Arrays: Impedance matching in high-speed PCBs.
• Industrial Control Systems: Durable performance in harsh environments.
• Test & Measurement Equipment: Stable resistance for calibration circuits.

Conclusion of GS4B018060JFT

The GS4B018060JFT combines ceramic durability, thin-film precision, and space-saving integration to address complex circuit design challenges. Its bussed architecture reduces BOM complexity, while the ±100ppm/°C TCR ensures minimal drift under thermal stress. Though not RoHS-compliant, it excels in industrial and telecom applications where reliability outweighs regulatory constraints. Engineers will value its SOIC footprint compatibility and consistent ratio tolerance for repeatable performance in analog/digital hybrid systems.