


TT Electronics/IRC
GS4B0190R9GT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B0190R9GT Description
GS4B0190R9GT Description
The GS4B0190R9GT from TT Electronics/IRC is a high-reliability 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable performance under varying conditions. Featuring a 90.9Ω resistance per element with a tight ±2% tolerance and a ±100ppm/°C temperature coefficient, this ceramic-based thin-film resistor network ensures consistent operation across a 70°C to 125°C derated power range, with a maximum operating temperature of 125°C. Its 0.05W (1/20) power rating per resistor and 0.4W total power handling make it suitable for low-power circuits, while the 100V maximum voltage rating enhances versatility in signal conditioning and voltage division applications.
GS4B0190R9GT Features
- Ceramic substrate for superior thermal stability and durability.
- Bussed (BUS) configuration simplifies circuit design by interconnecting resistors.
- Thin-film technology delivers low noise and high precision.
- Gull-wing termination ensures reliable surface-mount (SMD) compatibility.
- Compact SOIC package (4.9mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
- Non-automotive (PPAP: No) but ideal for industrial and telecom applications.
- Non-RoHS compliant, suitable for legacy or specialized designs.
GS4B0190R9GT Applications
This resistor network excels in:
- Voltage dividers and pull-up/down circuits in embedded systems.
- Signal conditioning for sensors and ADCs in measurement equipment.
- Bus termination in communication interfaces (e.g., I2C, SPI).
- Power supply feedback networks requiring stable resistance over temperature.
- Industrial control systems where ceramic construction resists environmental stress.
Conclusion of GS4B0190R9GT
The GS4B0190R9GT stands out for its precision, compact form factor, and robust ceramic construction, making it a preferred choice for engineers designing high-density PCBs or systems demanding thermal stability. While not automotive-grade, its 2% tolerance and bussed topology reduce component count in bus-oriented circuits, streamlining BOMs. Ideal for telecom, test equipment, and industrial electronics, this network balances performance with cost-effectiveness in non-RoHS applications.



.png)















.png?x-oss-process=image/format,webp/resize,h_32)










