TT Electronics/IRC

GS4B019760BBT

GS4B019760BBT Description

The GS4B019760BBT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. It features 7 resistors in a 976 Ohm configuration with an ultra-tight 0.1% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in a ceramic SOIC-8 package, this surface-mount device (SMD) offers a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for precision analog and digital circuits. Its gull-wing termination and 1.27mm pitch facilitate reliable PCB assembly.

GS4B019760BBT Features

• Precision Thin Film Technology: Delivers high accuracy (±0.1%) and low TCR (±100ppm/°C) for stable operation.
• Robust Ceramic Package: Ensures durability and thermal stability in harsh environments.
• Compact SOIC-8 Form Factor: Space-saving 4.9mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• BUS Circuit Design: Optimized for bus termination, voltage division, and pull-up/down applications.
• Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.
• Non-Automotive Grade: Ideal for industrial, telecom, and test equipment where PPAP compliance is not required.

GS4B019760BBT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage references, DAC/ADC interfaces, and signal conditioning.
• Digital Systems: Bus termination for high-speed data lines (e.g., DDR, LVDS).
• Industrial Electronics: PLCs, sensors, and power management modules requiring long-term stability.
• Test & Measurement Equipment: Calibration circuits and instrumentation amplifiers.
• Telecom Infrastructure: RF and baseband signal processing where low drift is critical.

Conclusion of GS4B019760BBT

The GS4B019760BBT combines high precision, compact design, and robust performance, making it a superior choice for applications demanding tight tolerance and thermal stability. Its ceramic SOIC package and thin-film technology provide reliability in industrial and telecom environments, while the BUS-oriented design simplifies integration into complex circuits. Though not PPAP or RoHS compliant, its technical merits position it as a cost-effective solution for non-automotive precision electronics.