TT Electronics/IRC_GS4B019761DDT
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TT Electronics/IRC
GS4B019761DDT

50-GS4B019761DDT
PDF Datasheet
Res Thin Film NET 9.76K Ohm 0.5% 0.4W ±100ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B019761DDT Description

GS4B019761DDT Description

The GS4B019761DDT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 9.76KΩ resistance per element with an ultra-tight ±0.5% tolerance and a ±100ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this component is engineered for reliability in demanding circuits. Its gull-wing termination and 1.27mm pitch facilitate seamless PCB integration, while the ceramic substrate enhances thermal performance.

GS4B019761DDT Features

  • Precision Thin Film Technology: Delivers low noise and high accuracy (±0.5%) for sensitive analog/digital systems.
  • Robust Ceramic Construction: Superior heat dissipation and mechanical strength vs. polymer-based arrays.
  • BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
  • Extended Temperature Range: Stable performance from 70°C to 125°C with derated power handling.
  • Compact SOIC-8 Package: Space-saving 4.9mm × 5.99mm × 1.45mm footprint with ±0.1mm length/height tolerances.
  • Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation where PPAP compliance isn’t required.

GS4B019761DDT Applications

This resistor network excels in:

  • Bus Termination: Matched impedance for high-speed data lines (e.g., DDR memory, CAN buses).
  • Precision Voltage Dividers: Critical in ADC/DAC reference circuits and sensor signal conditioning.
  • Pull-Up/Down Networks: Ensures stable logic levels in microcontroller and FPGA designs.
  • Medical/Test Equipment: Where low TCR (±100ppm/°C) minimizes drift in measurement systems.
  • Aerospace & Defense: Ceramic packaging withstands thermal cycling and mechanical stress.

Conclusion of GS4B019761DDT

The GS4B019761DDT stands out for its combination of precision, power efficiency, and ruggedness, making it a top choice for engineers prioritizing signal integrity in harsh environments. While not RoHS-compliant, its ceramic SOIC package and thin film technology offer a compelling alternative to standard arrays in industrial and high-reliability applications. For designs requiring tight-tolerance, multi-resistor networks with proven thermal performance, this TT Electronics/IRC solution delivers exceptional value.

FAQ

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The standard lead time for GS4B019761DDT is 30 weeks.
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