TT Electronics/IRC

GS4B021003FAT

GS4B021003FAT Description

The GS4B021003FAT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 7-resistor BUS-configuration array offers a 100K Ohm resistance with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in a ceramic SOIC-8 package, it features gull-wing SMD termination for reliable surface-mount assembly. With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this component is engineered for durability in demanding circuits. Its compact dimensions (4.9mm x 5.99mm x 1.45mm) and ±0.1mm length/height tolerances make it ideal for space-constrained designs.

GS4B021003FAT Features

• Precision Thin Film Technology: Delivers excellent stability and low noise.
• High-Density Integration: 7 resistors in an 8-pin SOIC package optimize PCB space.
• Wide Operating Range: Rated for -55°C to +125°C with derated power up to 125°C.
• Robust Construction: Ceramic substrate ensures thermal and mechanical reliability.
• Automation-Friendly: Gull-wing terminals enable efficient pick-and-place assembly.
• Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation use.

GS4B021003FAT Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision-matched resistors minimize skew in signal conditioning.
• ADC/DAC Interfaces: Low TCR (±50ppm/°C) ensures accuracy in data conversion systems.
• Industrial Control Systems: Ceramic case withstands harsh environments with high thermal stability.
• Medical Electronics: Thin-film technology meets low-noise requirements for sensitive equipment.
• Telecom Infrastructure: Compact footprint suits high-density RF and baseband PCBs.

Conclusion of GS4B021003FAT

The GS4B021003FAT combines precision, compactness, and reliability, making it a superior choice for applications demanding tight tolerance and thermal stability. While not RoHS-compliant, its ceramic packaging and thin-film technology offer long-term performance advantages over polymer-based alternatives. Ideal for engineers prioritizing space efficiency, signal integrity, and ruggedness in industrial and communication systems.