TT Electronics/IRC

GS4B021050FBT

GS4B021050FBT Description

The GS4B021050FBT from TT Electronics/IRC is a high-performance 7-resistor thin film network designed for precision applications. Encased in a ceramic SOIC-8 package, it offers a 105Ω resistance per element with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this surface-mount network features gull-wing terminations with a 1.27mm pitch for reliable PCB integration. Its compact dimensions (4.9mm × 5.99mm × 1.45mm) and ceramic construction enhance thermal and mechanical robustness, though it is non-compliant with EU RoHS.

GS4B021050FBT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±1%) for signal conditioning.
• Ceramic Case: Superior heat dissipation and durability vs. polymer-based networks.
• BUS Circuit Design: Optimized for bus termination, voltage division, and pull-up/down applications.
• Wide Temperature Range: Stable performance from -70°C to +125°C (derated above 70°C).
• Automotive-Grade Alternatives: While this model is not PPAP/automotive-qualified, its 125°C rating suits industrial and telecom applications.
• Gull-Wing SMD Terminations: Facilitates automated assembly and inspection.

GS4B021050FBT Applications

Ideal for:

• Bus Termination Networks: DDR memory, CAN, and I²C interfaces requiring precise impedance matching.
• Voltage Dividers: Sensor signal conditioning in industrial controls.
• Pull-Up/Down Arrays: Microcontroller I/O port stabilization.
• Aerospace/Defense Systems: Non-RoHS compliance may align with legacy or specialized designs.

Conclusion of GS4B021050FBT

The GS4B021050FBT excels in precision analog circuits where low TCR, tight tolerance, and ceramic reliability are critical. Its 7-resistor BUS configuration and thin film technology make it a superior choice over thick-film networks in high-frequency or thermally demanding environments. While unsuitable for automotive or RoHS-regulated projects, it is a cost-effective solution for industrial, telecom, and embedded systems requiring robust performance.