TT Electronics/IRC

GS4B021070JDT

GS4B021070JDT Description

The GS4B021070JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Encased in a ceramic SOIC-C series housing, it offers a 107Ω resistance per element with a ±5% absolute tolerance and ±0.5% ratio tolerance, ensuring consistent performance in matched circuits. Its thin-film technology delivers a low ±50ppm/°C temperature coefficient, critical for environments with thermal fluctuations. Rated for 0.05W (1/20) per resistor and 0.4W total power, it operates reliably across a 70°C to 125°C derated range, with a 100V maximum voltage rating. The gull-wing termination and 1.27mm pitch facilitate easy surface-mount assembly, while the compact 4.9mm × 5.99mm × 1.45mm footprint suits space-constrained designs.

GS4B021070JDT Features

• Bussed Network: 7 resistors tied to a common bus, simplifying circuit design.
• High Stability: Ceramic substrate and thin-film construction ensure long-term reliability.
• Precision Tolerance: ±5% absolute and ±0.5% ratio tolerance for matched applications.
• Wide Temperature Range: Operates from -55°C to 125°C (derated power above 70°C).
• Low TCR: ±50ppm/°C minimizes resistance drift.
• Robust Packaging: SOIC-8 with gull-wing leads for automated SMT processes.
• Non-Automotive: Suitable for industrial, telecom, and instrumentation use.

GS4B021070JDT Applications

• Voltage Dividers: Precision ratio tolerance ideal for sensor signal conditioning.
• Bus Termination: Stable resistance for high-speed digital lines (e.g., memory modules).
• Analog Circuits: Low TCR critical for amplifiers and filters.
• Power Management: Distributed load balancing in multi-rail systems.
• Test Equipment: Calibration circuits requiring tight tolerance matching.

Conclusion of GS4B021070JDT

The GS4B021070JDT excels in applications demanding precision, thermal stability, and compactness. Its ceramic thin-film design, combined with low TCR and tight tolerances, makes it superior to standard thick-film networks in critical environments. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial electronics, telecom infrastructure, and test instrumentation. The SOIC-8 package ensures compatibility with high-volume SMT assembly, offering a reliable balance of performance and manufacturability.