TT Electronics/IRC

GS4B021072CT

GS4B021072CT Description

The GS4B021072CT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. Built with ceramic substrate and thin-film technology, it delivers exceptional stability with a ±50ppm/°C temperature coefficient and a tight ±0.25% tolerance. The network features a 10.7KΩ resistance value per element, rated for 0.05W (1/20W) power dissipation per resistor and 0.4W total power. Its SOIC-C series construction ensures robust performance across a wide temperature range (70°C to 125°C derated, 125°C max) and up to 100V maximum voltage. The gull-wing termination and 1.27mm pitch facilitate reliable PCB mounting.

GS4B021072CT Features

• Precision Network: 7 bussed resistors with 0.25% absolute tolerance for critical analog/digital circuits.
• Stable Thin-Film Technology: Low TCR (±50ppm/°C) ensures minimal resistance drift.
• High-Density SOIC Package: Compact 4.9mm × 5.99mm × 1.45mm footprint (±0.1mm tolerance) saves board space.
• Robust Ceramic Substrate: Superior thermal and mechanical durability vs. polymer-based arrays.
• Automation-Friendly: Tube packaging and surface-mount design streamline assembly.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and instrumentation systems.

GS4B021072CT Applications

• Voltage Divider Networks: Precision attenuation in sensor interfaces or ADC front-ends.
• Bus Termination: Signal integrity in high-speed digital systems (e.g., memory buses).
• Industrial Controls: Stable feedback loops in PLCs or motor drivers.
• Test & Measurement Equipment: Calibration circuits requiring low drift.
• Aerospace & Defense: Reliable performance in harsh environments (non-automotive).

Conclusion of GS4B021072CT

The GS4B021072CT excels in applications demanding high precision, thermal stability, and compactness. Its ceramic thin-film construction and bussed architecture offer superior reliability over standard thick-film networks, while the SOIC package ensures compatibility with automated assembly. Though not PPAP or RoHS compliant, it remains a top choice for industrial, instrumentation, and high-reliability designs where tolerance and temperature performance are critical.