TT Electronics/IRC

GS4B021130FT

GS4B021130FT Description

The GS4B021130FT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding environments. Encased in a ceramic SOIC package, this thin-film resistor network offers a 113Ω resistance per element with a tight ±1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of -70°C to +125°C. Its 8-pin narrow SOIC (SOIC-C) form factor (4.9mm × 5.99mm × 1.45mm) and gull-wing termination make it ideal for automated surface-mount assembly. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness with robust performance.

GS4B021130FT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology delivers precision (±1%) and low TCR (±50ppm/°C).
• Bussed circuit design simplifies layout in bus-line applications.
• Narrow SOIC (SOIC-C) package saves board space while supporting high-density designs.
• Wide derated power range (70°C to 125°C) ensures reliability under thermal stress.
• Gull-wing leads enable reliable solder joints in SMT processes.
• Non-automotive grade (PPAP: No) but suitable for industrial and telecom applications.

GS4B021130FT Applications

This resistor network excels in:

• Voltage division and pull-up/down circuits in precision analog systems.
• Bus termination networks for digital communication interfaces (e.g., I²C, SPI).
• Signal conditioning in test/measurement equipment and industrial controls.
• Power supply feedback loops where stable resistance values are critical.
• Space-constrained PCBs due to its compact SOIC footprint.

Conclusion of GS4B021130FT

The GS4B021130FT stands out for its ceramic-based construction, thin-film accuracy, and bussed topology, making it a superior choice for applications requiring stable resistance in harsh environments. While not RoHS-compliant, its thermal resilience (±50ppm/°C) and 1% tolerance cater to niche industrial and telecom needs where reliability outweighs regulatory constraints. Its SOIC-C package bridges the gap between precision and space efficiency, ideal for modern high-density electronics.