TT Electronics/IRC

GS4B021132DT

GS4B021132DT Description

The GS4B021132DT from TT Electronics/IRC is a high-precision Ceramic Resistor Network designed for demanding surface-mount applications. This 8-pin Narrow SOIC (SOIC-C Series) component features 7 bussed resistors with a 11.3KΩ resistance value and an exceptional ±0.5% absolute tolerance. Built with thin-film technology, it delivers stable performance across a wide temperature range (70°C to 125°C) and a ±50ppm/°C temperature coefficient, ensuring reliability in thermally dynamic environments. With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is engineered for precision and durability. Its gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical robustness.

GS4B021132DT Features

• High Precision: ±0.5% tolerance and ±50ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case (SOIC package) ensures thermal and mechanical resilience.
• Optimized Power Handling: 0.4W total power (0.05W per resistor) with derating up to 125°C.
• Space-Efficient: Compact dimensions (4.9mm × 5.99mm × 1.45mm) suit high-density designs.
• Automation-Friendly: Gull-wing termination and 1.27mm pitch for seamless SMT assembly.
• Non-Automotive/Non-PPAP: Ideal for industrial, telecom, and instrumentation applications.

GS4B021132DT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage Dividers & Signal Conditioning: Stable resistance values ensure accurate signal processing.
• Sensor Interfaces: Low TCR minimizes drift in temperature-sensitive systems.
• Medical & Test Equipment: High reliability meets stringent performance requirements.
• Industrial Control Systems: Ceramic construction withstands harsh operating conditions.
• Telecom Infrastructure: Compact footprint suits high-density PCBs in base stations and routers.

Conclusion of GS4B021132DT

The GS4B021132DT combines precision, durability, and space efficiency, making it a superior choice for applications demanding tight tolerances and thermal stability. While not PPAP or automotive-qualified, its ceramic thin-film design and bussed architecture cater to industrial, medical, and telecom needs. Engineers will appreciate its ease of integration and consistent performance, solidifying its role in high-reliability electronic systems.