TT Electronics/IRC_GS4B021370DBT
original

TT Electronics/IRC
GS4B021370DBT

50-GS4B021370DBT
PDF Datasheet
Res Thin Film NET 137 Ohm 0.5% 0.4W ±50ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B021370DBT Description

GS4B021370DBT Description

The GS4B021370DBT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor array features a 137 Ohm resistance value with an ultra-tight 0.5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a ceramic SOIC-8 package, it offers 0.4W total power dissipation (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for precision analog and digital circuits. The gull-wing termination and surface-mount design facilitate automated assembly, while its compact dimensions (4.9mm x 5.99mm x 1.45mm) save board space.

GS4B021370DBT Features

  • Precision Thin Film Technology: Delivers high accuracy (±0.5%) and low TCR (±50ppm/°C) for stable operation.
  • Robust Ceramic Construction: Enhances thermal performance and reliability in harsh environments.
  • Optimized Power Handling: 0.4W total power rating (0.05W per resistor) with derating up to 125°C.
  • Space-Efficient SOIC-8 Package: Ideal for high-density PCB layouts.
  • Automation-Friendly Gull Wing Terminals: Ensures reliable solder joints in SMT processes.
  • Non-Automotive (PPAP No): Suitable for industrial, medical, and telecom applications.

GS4B021370DBT Applications

This resistor network excels in:

  • Precision Voltage Dividers: Critical in ADC/DAC reference circuits.
  • Signal Conditioning: For sensors and instrumentation requiring minimal drift.
  • Bus Termination Networks: Ensures signal integrity in high-speed digital systems (e.g., DDR memory, FPGA interfaces).
  • Medical Electronics: Where stability and compactness are paramount.
  • Industrial Control Systems: Resilient against temperature fluctuations.

Conclusion of GS4B021370DBT

The GS4B021370DBT stands out for its combination of precision, power efficiency, and compact form factor. Its ceramic SOIC package and thin-film technology make it a superior choice over thicker-film or less stable alternatives. While not RoHS-compliant, it remains ideal for non-consumer applications demanding long-term reliability. Engineers will appreciate its balance of performance and manufacturability in high-reliability systems.

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