TT Electronics/IRC_GS4B021400GGT
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TT Electronics/IRC
GS4B021400GGT

50-GS4B021400GGT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,8-Pin Narrow SOIC, Bussed elements,±50ppm/°C, 140Ohm, absolute tolerance ±2%, ratio tolerance ±2%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B021400GGT Description

GS4B021400GGT Description

The GS4B021400GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 8-pin narrow SOIC package features 7 bussed resistors with a 140Ω resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC-C series construction provides robust mechanical integrity, while the gull-wing termination ensures reliable surface-mount connectivity. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, it operates reliably within a 70°C to 125°C derated power range, peaking at 125°C maximum operating temperature.

GS4B021400GGT Features

  • Ceramic case style: Enhances thermal and mechanical durability.
  • Bussed network (BUS): Simplifies circuit design with shared connections.
  • Precision thin-film resistors: Delivers low TCR (±50ppm/°C) and tight tolerance (±2%).
  • SOIC package (4.9mm x 5.99mm x 1.45mm): Compact footprint with ±0.1mm length/height tolerances.
  • Gull-wing terminals: Ensures secure PCB mounting and solderability.
  • Wide operating range: Supports industrial and automotive-derivative applications (non-Automotive PPAP).
  • Non-RoHS compliant: Suitable for legacy or specialized systems.

GS4B021400GGT Applications

Ideal for precision analog circuits, voltage dividers, and signal conditioning in:

  • Industrial control systems: Where stable resistance under thermal stress is critical.
  • Test and measurement equipment: Demanding low drift and high accuracy.
  • Power management modules: Utilizing bussed networks for current sharing.
  • Legacy electronics: Needing non-RoHS compliant components.

Conclusion of GS4B021400GGT

The GS4B021400GGT stands out for its ceramic-based reliability, thin-film precision, and compact SOIC design, offering superior performance in harsh environments. While not PPAP-capable, its 2% tolerance and low TCR make it a cost-effective choice for industrial and instrumentation applications where stability and durability are paramount. Its bussed configuration further simplifies layout challenges, reducing board space and assembly complexity.

FAQ

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Yes. Related or alternative parts may be available on this page when relevant product data is provided.
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