TT Electronics/IRC

GS4B021600FT

GS4B021600FT Description

The GS4B021600FT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 160Ω resistance per element with a tight ±1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of 70°C to 125°C. The thin-film technology delivers superior accuracy and reliability, while the ceramic case enhances thermal and mechanical durability. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for demanding circuits requiring consistent performance.

GS4B021600FT Features

• Bussed Network Design: 7 resistors connected in a bus configuration, simplifying PCB layout and reducing component count.
• High Precision: ±1% absolute tolerance and ±50ppm/°C TCR ensure minimal drift in critical applications.
• Robust Construction: Ceramic SOIC package offers excellent thermal dissipation and mechanical strength.
• Surface-Mount Gull Wing Terminals: Facilitates automated assembly with a 1.27mm terminal pitch.
• Wide Temperature Range: Derated power operation up to 125°C, ideal for harsh environments.
• Compact Dimensions: 4.9mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).

GS4B021600FT Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision bussed networks reduce parasitic effects in analog/digital interfaces.
• Automotive & Industrial Electronics: Despite non-automotive PPAP status, its 125°C rating suits under-hood or control modules.
• Signal Conditioning: Stable TCR minimizes error in sensor networks or ADC/DAC circuits.
• Power Management: Distributed power dissipation across multiple resistors enhances reliability in power supplies.

Conclusion of GS4B021600FT

The GS4B021600FT stands out for its precision, compactness, and rugged ceramic construction, making it a superior choice for engineers prioritizing stability in high-temperature or space-constrained designs. Its bussed architecture streamlines circuit integration, while thin-film technology ensures long-term accuracy. Ideal for industrial, telecom, and instrumentation applications where consistent performance is critical.