TT Electronics/IRC

GS4B021601JT

GS4B021601JT Description

The GS4B021601JT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for precision surface-mount applications. This thin-film resistor network offers a 1.6KΩ resistance per element with a ±5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it is engineered for reliability in demanding circuits. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical durability.

GS4B021601JT Features

• Bussed Network Design: Simplifies circuit layout with shared connections, reducing component count.
• High-Temperature Stability: Operates reliably up to 125°C with derated power up to 70°C.
• Precision Thin Film: Delivers low TCR (±50ppm/°C) and tight tolerance (±5%) for consistent performance.
• Robust Construction: Ceramic SOIC package ensures superior heat dissipation and mechanical strength.
• Space-Efficient: Compact 4.9mm × 5.99mm × 1.45mm footprint ideal for high-density designs.
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its robustness suits industrial and telecom applications.

GS4B021601JT Applications

• Voltage Divider Networks: Precision dividers in analog signal conditioning.
• Pull-Up/Pull-Down Arrays: Simplifies logic level management in digital circuits.
• Industrial Control Systems: Stable performance in PLCs, sensors, and power management.
• Telecommunications Equipment: Reliable signal processing in RF and baseband circuits.
• Test & Measurement Instruments: Low-drift resistance for calibration and feedback loops.

Conclusion of GS4B021601JT

The GS4B021601JT excels in space-constrained, high-reliability applications requiring stable resistance values under thermal stress. Its ceramic thin-film construction, bussed topology, and low TCR make it a superior choice over generic thick-film networks. While not RoHS-compliant, it remains a cost-effective solution for industrial, telecom, and instrumentation designs where precision and durability are critical. Engineers will appreciate its ease of integration and consistent performance in harsh environments.