TT Electronics/IRC

GS4B021651GGT

GS4B021651GGT Description

The GS4B021651GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 7-resistor bussed network features a 1.65KΩ resistance value with a tight ±2% absolute tolerance and ±2% ratio tolerance, ensuring consistent performance in matched-resistor applications. Encased in an 8-pin narrow SOIC (SOIC-C) package, it offers a compact footprint (4.9mm × 5.99mm × 1.45mm) with gull-wing terminations for reliable surface-mount assembly. The thin-film technology delivers excellent stability with a low ±50ppm/°C temperature coefficient, making it ideal for environments with fluctuating thermal conditions. Rated for 100V maximum voltage and 0.4W total power dissipation, it operates across a -70°C to +125°C range, with derated power handling up to 125°C.

GS4B021651GGT Features

• Ceramic substrate for enhanced thermal and mechanical robustness.
• Bussed topology simplifies circuit design by interconnecting resistors.
• High precision: ±2% tolerance (absolute/ratio) and ±50ppm/°C TCR.
• Compact SOIC package: Space-saving 8-pin narrow profile (1.27mm pitch).
• Wide operating range: -70°C to +125°C, suitable for industrial and automotive (non-PPAP) applications.
• Thin-film construction: Delivers low noise and long-term stability.
• Non-RoHS (EU) compliance for legacy or specialized designs.

GS4B021651GGT Applications

This resistor network excels in:

• Voltage divider circuits requiring matched resistance ratios.
• Signal conditioning in sensor interfaces and ADC/DAC peripherals.
• Bus termination for digital communication lines (e.g., CAN, SPI).
• Industrial control systems where temperature stability is critical.
• Legacy equipment maintenance due to its non-RoHS status.

Conclusion of GS4B021651GGT

The GS4B021651GGT stands out for its precision, compactness, and thermal resilience, making it a reliable choice for engineers designing high-stability analog or mixed-signal circuits. Its bussed architecture reduces component count, while the ceramic SOIC package ensures durability in harsh environments. While not automotive-qualified, its wide temperature range and low TCR make it suitable for industrial, telecom, and instrumentation applications where consistent performance is paramount.