TT Electronics/IRC

GS4B021651JDT

GS4B021651JDT Description

The GS4B021651JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film technology. Encased in a ceramic substrate, it offers superior thermal stability with a ±50ppm/°C temperature coefficient and operates across a wide temperature range of -70°C to +125°C. The network features a 1.65KΩ resistance per element with a ±5% absolute tolerance and ±0.5% ratio tolerance, ensuring consistent performance in matched-resistor circuits. Its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding environments.

GS4B021651JDT Features

• Ceramic Construction: Enhances thermal dissipation and reliability in high-temperature applications.
• Thin Film Technology: Delivers low noise and high precision (±50ppm/°C TCR).
• Bussed Network Design: Simplifies PCB layout for bus termination or voltage division.
• Gull Wing Termination: Ensures robust surface-mount compatibility (SOIC-8 package).
• Tight Tolerances: ±5% absolute and ±0.5% ratio tolerance for precision analog circuits.
• Wide Operating Range: -70°C to +125°C with derated power up to 125°C.

GS4B021651JDT Applications

Ideal for precision analog circuits, sensor interfaces, and voltage divider networks, this resistor array excels in:

• Industrial Control Systems: Where stable resistance ratios are critical.
• Automotive Electronics: Despite non-automotive PPAP status, its temperature resilience suits under-hood sensors.
• Test & Measurement Equipment: Leveraging low TCR for calibration circuits.
• Power Management: Bus termination in high-speed digital systems (e.g., DDR memory).

Conclusion of GS4B021651JDT

The GS4B021651JDT stands out for its ceramic-based durability, thin-film precision, and bussed configuration, offering engineers a reliable solution for matched-resistor applications. While non-compliant with EU RoHS, its wide temperature range and low TCR make it a top choice for industrial and high-reliability designs. Its SOIC-8 package ensures compatibility with automated assembly processes, balancing performance and manufacturability.