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GS4B021690GGT
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GS4B021690GGT Description
GS4B021690GGT Description
The GS4B021690GGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 169Ω resistance value per element with an absolute tolerance of ±2% and a ratio tolerance of ±2%. The thin-film technology ensures low temperature coefficient (±50ppm/°C) and stable performance across a wide temperature range (70°C to 125°C at derated power, max 125°C). With a power rating of 0.4W (0.05W per resistor) and 100V maximum voltage rating, this network is ideal for demanding circuits requiring reliability and consistency.
GS4B021690GGT Features
- Ceramic SOIC Package: Robust construction with 4.9mm length, 5.99mm depth, and 1.45mm height (±0.1mm tolerance), suitable for surface-mount applications.
- Bussed Network Design: Simplifies PCB layout with common BUS connection, reducing component count.
- High Precision: ±2% tolerance and ±50ppm/°C TCR ensure stability in varying thermal conditions.
- Thin-Film Technology: Delivers superior performance over thick-film alternatives, with lower noise and higher accuracy.
- Automotive & Industrial Suitability: Though not PPAP or automotive-qualified, its 125°C operating range makes it suitable for harsh environments.
GS4B021690GGT Applications
- Voltage Divider Networks: Precision dividers in sensor interfaces or ADC circuits.
- Bus Termination: Ideal for digital signal lines requiring matched impedance.
- Industrial Control Systems: Reliable performance in PLC I/O modules or power management PCBs.
- Test & Measurement Equipment: Low-drift resistance networks for calibration or signal conditioning.
Conclusion of GS4B021690GGT
The GS4B021690GGT excels in precision, thermal stability, and space efficiency, making it a standout choice for high-density PCB designs requiring bussed resistor networks. Its ceramic construction, thin-film technology, and tight tolerances provide a competitive edge in industrial, instrumentation, and communication systems. While not automotive-grade, its wide temperature range and robust packaging ensure reliability in most demanding applications.



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