TT Electronics/IRC

GS4B021692JFT

GS4B021692JFT Description

The GS4B021692JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding electronic circuits. Encased in a narrow SOIC (SOIC-C) ceramic package, this thin-film resistor network offers a 16.9KΩ resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±1%, ensuring consistent performance in matched-resistor applications. Its ±50ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with thermal fluctuations. The 8-pin gull-wing termination and surface-mount design facilitate easy integration into compact PCB layouts.

GS4B021692JFT Features

• Bussed Network Design: Simplifies circuit routing with a shared common node (BUS) for streamlined designs.
• High Power Handling: 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating for robust operation.
• Stable Thin-Film Technology: Delivers low noise and high accuracy compared to thick-film alternatives.
• Precision Tolerances: ±5% absolute and ±1% ratio tolerance for critical analog/digital signal conditioning.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, ideal for industrial and automotive-adjacent applications.
• Mechanical Durability: Ceramic case ensures thermal stability and resistance to mechanical stress.

GS4B021692JFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance ensures accurate signal scaling.
• Sensor Interface Modules: Stable performance in temperature-sensitive environments (e.g., industrial sensors).
• Analog Signal Processing: Low TCR (±50ppm/°C) minimizes drift in feedback networks.
• Power Management Systems: Bussed design reduces component count in power distribution PCBs.
• Test & Measurement Equipment: High repeatability and tolerance matching for calibration circuits.

Conclusion of GS4B021692JFT

The GS4B021692JFT combines precision, durability, and space efficiency, making it a superior choice for engineers designing high-reliability analog systems. Its ceramic construction, tight tolerances, and bussed architecture address challenges in signal integrity and thermal management, while the SOIC package ensures compatibility with automated assembly processes. Ideal for industrial, instrumentation, and embedded systems, this network balances performance with cost-effectiveness in volume production.