TT Electronics/IRC

GS4B021782FAT

GS4B021782FAT Description

The GS4B021782FAT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor array features a 17.8KΩ resistance value per element with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a ceramic SOIC-8 package with gull-wing terminations, it offers excellent thermal stability and reliability for surface-mount designs. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for precision analog and digital circuits.

GS4B021782FAT Features

• Circuit Designator: BUS configuration for simplified PCB layout.
• Thin-Film Technology: Delivers high accuracy, low noise, and superior stability.
• Robust Construction: Ceramic case ensures durability and efficient heat dissipation.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Automotive-Grade Alternatives: While not PPAP or automotive-qualified, its 125°C max operating temperature suits industrial environments.
• Non-RoHS Compliant: Ideal for legacy or niche applications requiring specific material compliance.

GS4B021782FAT Applications

• Signal Conditioning: Precision voltage dividers, feedback networks in op-amp circuits.
• Bus Termination: Effective for impedance matching in high-speed digital systems (e.g., memory buses).
• Industrial Controls: Stable performance in PLCs, sensor interfaces, and power management modules.
• Test & Measurement Equipment: Low-drift resistance networks for calibration and instrumentation.
• Aerospace & Defense: Reliable operation in non-RoHS compliant systems with extended thermal ranges.

Conclusion of GS4B021782FAT

The GS4B021782FAT excels in applications requiring high precision, thermal resilience, and compact integration. Its thin-film technology, ceramic encapsulation, and BUS configuration provide distinct advantages over thicker-film or less stable alternatives. While not suited for automotive use, it remains a robust choice for industrial, aerospace, and precision electronics where consistent performance under thermal stress is critical. The tube packaging ensures safe handling and storage, making it a practical option for medium-volume production.