TT Electronics/IRC_GS4B021870DBT
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TT Electronics/IRC
GS4B021870DBT

50-GS4B021870DBT
PDF Datasheet
Res Thin Film NET 187 Ohm 0.5% 0.4W ±50ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B021870DBT Description

GS4B021870DBT Description

The GS4B021870DBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for demanding circuit applications. Encased in a ceramic SOIC-8 package, it delivers 187Ω resistance per element with an ultra-tight ±0.5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide -70°C to +125°C operating range. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this BUS-designated array combines gull-wing surface-mount termination with a compact 4.9mm × 5.99mm × 1.45mm footprint, making it ideal for space-constrained PCB designs.

GS4B021870DBT Features

  • Precision Thin Film Technology: Delivers superior accuracy (±0.5%) and low TCR (±50ppm/°C) vs. thick-film alternatives.
  • Robust Ceramic Construction: Enhances thermal performance and reliability in high-temperature environments (up to 125°C).
  • Optimized Power Handling: 0.4W total rating (0.05W/resistor) with derating up to 125°C.
  • Space-Efficient SOIC-8 Package: Gull-wing leads enable reliable SMT assembly; ±0.1mm length/height tolerances ensure consistent placement.
  • Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation applications where extreme precision is critical.

GS4B021870DBT Applications

  • Voltage Division/Current Sensing: Precision resistor networks in ADC/DAC reference circuits.
  • Impedance Matching: High-frequency signal integrity in RF/communication systems.
  • Medical/Test Equipment: Stable performance in calibration and measurement devices.
  • Industrial Control Systems: Reliable operation in PLCs and motor drives with fluctuating temperatures.

Conclusion of GS4B021870DBT

The GS4B021870DBT excels in applications requiring tight tolerance, thermal stability, and compact design. Its ceramic thin-film construction and SOIC-8 package offer a competitive edge over polymer-based networks, particularly in high-reliability industrial and telecom systems. While not RoHS-compliant, its precision and durability make it a preferred choice for engineers prioritizing performance over regulatory constraints.

FAQ

What is the standard lead time for GS4B021870DBT?
The standard lead time for GS4B021870DBT is 30 weeks.
What package or case is GS4B021870DBT available in?
What is the mounting type of GS4B021870DBT?
What operating temperature range does GS4B021870DBT support?
Are there related or alternative parts for GS4B021870DBT?
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