


TT Electronics/IRC
GS4B021870DBT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B021870DBT Description
GS4B021870DBT Description
The GS4B021870DBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for demanding circuit applications. Encased in a ceramic SOIC-8 package, it delivers 187Ω resistance per element with an ultra-tight ±0.5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide -70°C to +125°C operating range. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this BUS-designated array combines gull-wing surface-mount termination with a compact 4.9mm × 5.99mm × 1.45mm footprint, making it ideal for space-constrained PCB designs.
GS4B021870DBT Features
- Precision Thin Film Technology: Delivers superior accuracy (±0.5%) and low TCR (±50ppm/°C) vs. thick-film alternatives.
- Robust Ceramic Construction: Enhances thermal performance and reliability in high-temperature environments (up to 125°C).
- Optimized Power Handling: 0.4W total rating (0.05W/resistor) with derating up to 125°C.
- Space-Efficient SOIC-8 Package: Gull-wing leads enable reliable SMT assembly; ±0.1mm length/height tolerances ensure consistent placement.
- Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation applications where extreme precision is critical.
GS4B021870DBT Applications
- Voltage Division/Current Sensing: Precision resistor networks in ADC/DAC reference circuits.
- Impedance Matching: High-frequency signal integrity in RF/communication systems.
- Medical/Test Equipment: Stable performance in calibration and measurement devices.
- Industrial Control Systems: Reliable operation in PLCs and motor drives with fluctuating temperatures.
Conclusion of GS4B021870DBT
The GS4B021870DBT excels in applications requiring tight tolerance, thermal stability, and compact design. Its ceramic thin-film construction and SOIC-8 package offer a competitive edge over polymer-based networks, particularly in high-reliability industrial and telecom systems. While not RoHS-compliant, its precision and durability make it a preferred choice for engineers prioritizing performance over regulatory constraints.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










