TT Electronics/IRC

GS4B021870JGT

GS4B021870JGT Description

The GS4B021870JGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed with thin-film technology on a ceramic substrate, it offers a 187Ω resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±2%. Its ±50ppm/°C temperature coefficient ensures stability across a wide operating range of -55°C to +125°C, derated up to 125°C. The SOIC-C series construction provides 0.4W total power dissipation (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for precision applications. The gull-wing termination and surface-mount design facilitate automated assembly, while the ceramic case enhances thermal and mechanical reliability.

GS4B021870JGT Features

• Bussed Network: 7 resistors connected in a common bus configuration for simplified circuit design.
• High Stability: ±50ppm/°C TCR and 5% tolerance ensure consistent performance under thermal stress.
• Robust Construction: Ceramic substrate and thin-film technology deliver superior durability and heat dissipation.
• Compact & Reliable: 4.9mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height, ±0.2mm depth) for space-constrained PCBs.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch enable high-speed SMT placement.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and telecom applications.

GS4B021870JGT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision resistance matching (±2% ratio tolerance) for sensor interfaces.
• Bus Termination: Stable performance in CAN, I2C, or SPI line termination.
• Industrial Controls: Reliable operation in PLC modules, motor drivers, and power supplies.
• Telecom Equipment: High-voltage tolerance for signal conditioning and filtering.
• Automotive (Non-Automotive Grade): Suitable for non-safety-critical systems like infotainment.

Conclusion of GS4B021870JGT

The GS4B021870JGT combines precision, compactness, and ruggedness, making it a versatile choice for high-density analog and digital circuits. Its ceramic thin-film design outperforms polymer-based networks in thermal stability, while the bussed architecture reduces component count. Though not PPAP or automotive-qualified, it is ideal for industrial, telecom, and consumer electronics where tight tolerance and reliability are critical. Engineers benefit from its ease of integration and consistent performance across harsh environments.