TT Electronics/IRC

GS4B021911DT

GS4B021911DT Description

The GS4B021911DT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. Featuring a 1.91KΩ resistance per element with an ultra-tight ±0.5% tolerance, this thin-film ceramic-based network ensures stable performance across a wide temperature range (70°C to 125°C). Its ±50ppm/°C temperature coefficient minimizes resistance drift, making it ideal for precision analog and digital circuits. The SOIC-C series construction offers superior thermal and mechanical stability, with a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating.

GS4B021911DT Features

• Ceramic substrate for enhanced durability and heat dissipation.
• Gull-wing termination ensures reliable solder joints in automated assembly.
• Bussed topology (BUS designator) simplifies PCB layout for common-node applications.
• 0.5% absolute tolerance and ±50ppm/°C TCR for precision signal conditioning.
• Compact footprint: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• Non-automotive (PPAP No) but suitable for industrial and telecom environments.
• Non-RoHS (legacy designs requiring high-temperature stability).

GS4B021911DT Applications

• Voltage dividers and pull-up/pull-down networks in precision ADCs/DACs.
• Impedance matching in RF and communication modules.
• Sensor signal conditioning (e.g., bridge networks in strain gauges).
• Power supply feedback loops requiring low drift.
• Legacy industrial systems where ceramic reliability outperforms polymer-based arrays.

Conclusion of GS4B021911DT

The GS4B021911DT excels in high-reliability, precision applications where thermal stability and tight tolerances are critical. Its ceramic SOIC package and thin-film technology provide a robust alternative to standard resistor arrays, particularly in harsh environments or legacy designs exempt from RoHS. While not automotive-grade, its performance consistency and compact form factor make it a preferred choice for industrial, medical, and telecom hardware. For engineers prioritizing accuracy over miniaturization, this network delivers exceptional value.