TT Electronics/IRC

GS4B021962FFT

GS4B021962FFT Description

The GS4B021962FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in an 8-pin narrow SOIC package, this bussed 7-resistor array offers a 19.6KΩ resistance value with an absolute tolerance of ±1% and a ratio tolerance of ±1%. Built with thin-film technology, it ensures low temperature coefficient (±50ppm/°C) and stable performance across a wide temperature range (70°C to 125°C). The SOIC-C series features a compact rectangular form factor (4.9mm x 5.99mm x 1.45mm) with gull-wing terminations, making it ideal for surface-mount assembly. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, it is suited for high-density PCB designs.

GS4B021962FFT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film resistors with ±50ppm/°C TCR for precision signal conditioning.
• Bussed network topology simplifies circuit design in voltage divider and bus termination applications.
• 1% tolerance ensures consistent performance in analog/digital systems.
• Narrow SOIC (SOIC-C) package optimizes board space in compact electronics.
• Gull-wing leads enable reliable surface-mount soldering.
• Wide operating temperature range (125°C max) for industrial and automotive environments (non-automotive PPAP).
• Non-RoHS compliant for legacy or specialized applications requiring leaded components.

GS4B021962FFT Applications

• Precision voltage dividers in sensor interfaces and ADC/DAC circuits.
• Bus termination networks for high-speed digital systems (e.g., memory modules).
• Signal conditioning in test/measurement equipment and medical devices.
• Industrial control systems requiring stable resistance under thermal stress.
• Legacy electronics where lead-containing components are mandated.

Conclusion of GS4B021962FFT

The GS4B021962FFT stands out for its ceramic construction, tight tolerances, and thermal resilience, making it a robust choice for precision analog and digital circuits. Its bussed design reduces component count, while the SOIC-C package ensures compatibility with high-density layouts. Though not RoHS-compliant, it fills a niche in industrial and legacy systems demanding reliability under harsh conditions. Engineers will value its balance of performance, size, and cost in critical signal-path applications.