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GS4B021962FT
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GS4B021962FT Description
GS4B021962FT Description
The GS4B021962FT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding electronic circuits. Encased in a ceramic SOIC package, this thin-film resistor network offers excellent stability and reliability with a 19.6KΩ resistance value and a tight ±1% tolerance. It operates across a wide temperature range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The 8-pin narrow SOIC (SOIC-C Series) package features gull-wing terminations for secure surface-mount assembly, while its ±50ppm/°C temperature coefficient ensures minimal resistance drift. Rated for 100V maximum voltage and 0.4W total power dissipation, this network is engineered for efficiency in compact designs.
GS4B021962FT Features
- Bussed Network Design: Simplifies circuit layout with a shared common node (BUS) for streamlined connectivity.
- High Precision: ±1% absolute tolerance and ±50ppm/°C TCR for stable performance in precision analog/digital systems.
- Robust Construction: Ceramic case enhances thermal and mechanical durability, ideal for harsh environments.
- Surface-Mount Ready: Gull-wing terminals and 1.27mm pitch ensure compatibility with automated PCB assembly.
- Wide Operating Range: Functions reliably from -70°C to +125°C with derated power up to 125°C.
- Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
GS4B021962FT Applications
- Voltage Division & Pull-Up/Down Networks: Ideal for ADC/DAC interfaces and microcontroller I/O conditioning.
- Industrial Controls: Suitable for PLCs, sensor signal conditioning, and power management modules.
- Automotive Electronics: Despite non-automotive PPAP status, its temperature resilience suits non-safety-critical subsystems.
- Medical Devices: Precision resistance networks for diagnostic equipment where drift must be minimized.
- Aerospace & Defense: Ceramic packaging and thin-film technology meet rigorous environmental demands.
Conclusion of GS4B021962FT
The GS4B021962FT stands out for its combination of precision, compactness, and thermal resilience, making it a superior choice for engineers designing high-reliability circuits. Its bussed architecture reduces PCB complexity, while the ceramic SOIC package ensures longevity in thermally challenging applications. Though not PPAP-certified, its performance aligns with industrial, medical, and aerospace needs where consistent resistance values and low TCR are critical. For designs requiring stable, space-efficient resistor networks, this model delivers exceptional value.



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