TT Electronics/IRC

GS4B022001JDT

GS4B022001JDT Description

The GS4B022001JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 2KΩ resistance value and ±5% absolute tolerance, it ensures reliable performance in compact circuit designs. The ceramic-based construction enhances thermal stability, supporting operation from 70°C to 125°C at derated power, with a ±50ppm/°C temperature coefficient. Rated for 100V maximum voltage and 0.4W total power dissipation, it combines durability with space efficiency.

GS4B022001JDT Features

• Bussed Network: 7 resistors share a common node, simplifying bus line designs.
• Thin Film Technology: Delivers low noise and high stability (±0.5% ratio tolerance).
• Robust Packaging: Ceramic SOIC case (4.9mm × 5.99mm × 1.45mm) with gull-wing leads for secure surface mounting.
• Wide Temperature Range: Operates up to 125°C, ideal for industrial environments.
• Precision Tolerance: ±5% absolute, ±0.5% ratio tolerance for matched performance.
• High Voltage Rating: 100V capability suits power-sensitive applications.

GS4B022001JDT Applications

• Analog Signal Conditioning: Precision dividers in sensor interfaces.
• Bus Termination: Effective for SPI/I²C line termination.
• Industrial Controls: Stable resistance in PLCs and motor drivers.
• Automotive Electronics: Non-automotive grade but usable in benign environments.
• Embedded Systems: Space-constrained PCBs requiring reliable resistor networks.

Conclusion of GS4B022001JDT

The GS4B022001JDT excels in high-density, precision circuits with its ceramic thin-film construction and bussed topology. While not PPAP or automotive-qualified, its low TCR (±50ppm/°C) and tight ratio tolerance make it a cost-effective choice for industrial and consumer electronics. The SOIC package ensures compatibility with automated assembly, balancing performance and manufacturability. Ideal for designers prioritizing thermal stability and compact layouts.