TT Electronics/IRC_GS4B022050DT
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TT Electronics/IRC
GS4B022050DT

50-GS4B022050DT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,8-Pin Narrow SOIC, Bussed elements,±50ppm/°C, 205Ohm, absolute tolerance ±0.5%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B022050DT Description

GS4B022050DT Description

The GS4B022050DT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. Featuring a 205Ω resistance per element with an ultra-tight ±0.5% tolerance, this ceramic-based thin-film network ensures stable performance across a wide temperature range (70°C to 125°C). Its ±50ppm/°C temperature coefficient minimizes resistance drift, making it ideal for precision circuits. The SOIC-C series construction offers robust 0.4W total power handling (0.05W per resistor) and 100V maximum voltage rating, with gull-wing terminations for reliable PCB mounting.

GS4B022050DT Features

  • Ceramic substrate for enhanced thermal stability and durability.
  • Bussed topology (BUS designator) simplifies circuit layout in voltage-divider or pull-up/down applications.
  • Thin-film technology delivers superior accuracy (±0.5%) and low TCR (±50ppm/°C).
  • Compact SOIC package (4.9mm × 5.99mm × 1.45mm) with ±0.1mm length/height tolerances for high-density designs.
  • 1.27mm terminal pitch ensures compatibility with automated assembly processes.
  • Non-automotive (PPAP: No) but suited for industrial, telecom, and instrumentation use.

GS4B022050DT Applications

This resistor network excels in:

  • Precision analog circuits (e.g., DAC/ADC reference networks).
  • Signal conditioning in test/measurement equipment.
  • Voltage division in power management ICs.
  • Pull-up/down arrays for digital buses (I²C, SPI).
  • Industrial control systems requiring stable resistance under thermal stress.

Conclusion of GS4B022050DT

The GS4B022050DT combines high accuracy, thermal resilience, and compact form factor, outperforming generic arrays in critical applications. Its ceramic construction and thin-film technology ensure long-term reliability, while the bussed design reduces component count. Though not RoHS-compliant, it remains a top choice for engineers prioritizing precision in harsh environments. Ideal for OEMs in aerospace, medical, and telecom sectors where tolerance stability is paramount.

FAQ

What is the standard lead time for GS4B022050DT?
The standard lead time for GS4B022050DT is 30 weeks.
What is the mounting type of GS4B022050DT?
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What is GS4B022050DT?
What operating temperature range does GS4B022050DT support?
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