TT Electronics/IRC

GS4B022200CT

GS4B022200CT Description

The GS4B022200CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in an 8-pin narrow SOIC package, this bussed 7-resistor array offers a 220Ω resistance per element with an exceptional ±0.25% absolute tolerance and a low ±50ppm/°C temperature coefficient. Its thin-film technology ensures stable performance across a wide temperature range (70°C to 125°C derated, 125°C max). The device features gull-wing terminations for reliable surface-mount (SMD) assembly, with a compact footprint (4.9mm × 5.99mm × 1.45mm) and 1.27mm terminal pitch. Rated for 100V max voltage and 0.4W total power dissipation, it is packaged in tubes for automated handling.

GS4B022200CT Features

• Precision Tolerance: ±0.25% absolute tolerance ensures accuracy in signal conditioning and voltage division.
• Stable TCR: ±50ppm/°C thin-film construction minimizes resistance drift under thermal stress.
• Robust Construction: Ceramic case (SOIC-C series) enhances durability and heat dissipation.
• Bussed Design: Simplified PCB layout with common-node configuration (BUS circuit designator).
• High Voltage Rating: Supports up to 100V, suitable for industrial and instrumentation use.
• Automation-Friendly: Gull-wing leads and standard SOIC footprint streamline pick-and-place assembly.
• Non-Automotive/Non-PPAP: Ideal for commercial and industrial applications without automotive compliance requirements.

GS4B022200CT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, DAC/ADC reference networks.
• Signal Conditioning: Sensor interfaces, feedback loops in control systems.
• Industrial Electronics: PLCs, test equipment, and power management modules.
• Communication Systems: Impedance matching in RF and low-noise analog stages.
• Medical Devices: High-reliability instrumentation where tolerance stability is critical.

Conclusion of GS4B022200CT

The GS4B022200CT combines precision, thermal stability, and compact packaging, making it a superior choice for applications demanding tight tolerance and repeatability. Its ceramic SOIC-C housing and bussed architecture reduce board space while improving reliability. Though not PPAP or automotive-qualified, it is well-suited for industrial, medical, and communication systems where performance outweighs cost sensitivity. Engineers will appreciate its low TCR, high voltage rating, and ease of integration in high-density designs.