TT Electronics/IRC

GS4B022321FBT

GS4B022321FBT Description

The GS4B022321FBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 8-pin narrow SOIC package features 7 bussed resistors with a 2.32KΩ resistance value and a tight ±1% absolute tolerance, ensuring reliable signal integrity. Built with thin-film technology, it offers a low ±50ppm/°C temperature coefficient, making it stable across a 70°C to 125°C operating range. The SOIC-C series construction provides robust thermal and mechanical performance, with a 0.4W total power rating (0.05W per resistor). Its 100V maximum voltage rating and gull-wing termination suit high-density PCB designs.

GS4B022321FBT Features

• Precision Network: 7 bussed resistors with ±0.1% ratio tolerance for matched performance.
• Stable Thin Film: ±50ppm/°C TCR ensures minimal drift under thermal stress.
• Robust Packaging: Ceramic SOIC case (4.9mm x 5.99mm x 1.45mm) with ±0.1mm height tolerance for consistent mounting.
• High Reliability: 125°C maximum operating temperature and 70°C derated power range for harsh environments.
• Surface-Mount Optimized: 1.27mm terminal pitch and gull-wing leads for automated assembly.

GS4B022321FBT Applications

Ideal for precision analog circuits, voltage dividers, and sensor interfaces where matched resistance and thermal stability are critical. Commonly used in:

• Industrial Control Systems: Signal conditioning in PLCs and DAQ modules.
• Medical Electronics: Low-drift amplification circuits.
• Automotive (Non-Automotive Rated): Diagnostic equipment and test fixtures.
• Communication Hardware: Impedance matching in RF front-ends.

Conclusion of GS4B022321FBT

The GS4B022321FBT excels in applications demanding tight tolerance, low thermal drift, and compact form factors. While not PPAP or automotive-qualified, its ceramic thin-film design and bussed architecture make it a superior choice for industrial and medical electronics. Engineers benefit from its balance of precision, power handling, and durability in space-constrained designs.