


TT Electronics/IRC
GS4B022321JDT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B022321JDT Description
GS4B022321JDT Description
The GS4B022321JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 2.32KΩ resistance value (±5% absolute tolerance, ±0.5% ratio tolerance) and a ±50ppm/°C temperature coefficient, it ensures reliable performance across a 70°C to 125°C derated power range. The ceramic case and gull-wing termination enable robust surface-mount integration, while its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits.
GS4B022321JDT Features
- Bussed Network Design: Simplifies PCB layout with shared connections for streamlined bus applications.
- Thin-Film Technology: Delivers superior stability and low noise compared to thick-film alternatives.
- Precision Tolerance: ±5% absolute and ±0.5% ratio tolerance ensure consistent performance in matched circuits.
- High-Temperature Resilience: Operates up to 125°C with derated power handling.
- Compact SOIC Package: 4.9mm × 5.99mm × 1.45mm dimensions (±0.1mm height/length tolerance) save board space.
- Non-Automotive Grade: Ideal for industrial and commercial applications where PPAP compliance is not required.
GS4B022321JDT Applications
This resistor network excels in:
- Voltage Divider Circuits: Precision ratio tolerance minimizes error in sensor interfaces.
- Bus Termination Networks: Bussed design reduces component count in data/address lines.
- Industrial Control Systems: Thin-film reliability suits harsh environments (e.g., PLCs, motor drives).
- Test & Measurement Equipment: Low TCR (±50ppm/°C) ensures accuracy over temperature fluctuations.
- Consumer Electronics: Compact SOIC footprint benefits space-constrained designs like IoT modules.
Conclusion of GS4B022321JDT
The GS4B022321JDT combines high-density integration, thermal stability, and precision tolerances in a cost-effective ceramic package. Its bussed architecture and thin-film construction make it a standout choice for engineers prioritizing signal integrity and board-space optimization in non-automotive applications. While not RoHS-compliant, its performance in industrial and commercial systems justifies its niche for legacy or specialized designs.



.png)















.png?x-oss-process=image/format,webp/resize,h_32)










