TT Electronics/IRC_GS4B022321JDT
original

TT Electronics/IRC
GS4B022321JDT

50-GS4B022321JDT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,8-Pin Narrow SOIC, Bussed elements,±50ppm/°C, 2.32KOhm, absolute tolerance ±5%, ratio tolerance ±0.5%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B022321JDT Description

GS4B022321JDT Description

The GS4B022321JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 2.32KΩ resistance value (±5% absolute tolerance, ±0.5% ratio tolerance) and a ±50ppm/°C temperature coefficient, it ensures reliable performance across a 70°C to 125°C derated power range. The ceramic case and gull-wing termination enable robust surface-mount integration, while its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits.

GS4B022321JDT Features

  • Bussed Network Design: Simplifies PCB layout with shared connections for streamlined bus applications.
  • Thin-Film Technology: Delivers superior stability and low noise compared to thick-film alternatives.
  • Precision Tolerance: ±5% absolute and ±0.5% ratio tolerance ensure consistent performance in matched circuits.
  • High-Temperature Resilience: Operates up to 125°C with derated power handling.
  • Compact SOIC Package: 4.9mm × 5.99mm × 1.45mm dimensions (±0.1mm height/length tolerance) save board space.
  • Non-Automotive Grade: Ideal for industrial and commercial applications where PPAP compliance is not required.

GS4B022321JDT Applications

This resistor network excels in:

  • Voltage Divider Circuits: Precision ratio tolerance minimizes error in sensor interfaces.
  • Bus Termination Networks: Bussed design reduces component count in data/address lines.
  • Industrial Control Systems: Thin-film reliability suits harsh environments (e.g., PLCs, motor drives).
  • Test & Measurement Equipment: Low TCR (±50ppm/°C) ensures accuracy over temperature fluctuations.
  • Consumer Electronics: Compact SOIC footprint benefits space-constrained designs like IoT modules.

Conclusion of GS4B022321JDT

The GS4B022321JDT combines high-density integration, thermal stability, and precision tolerances in a cost-effective ceramic package. Its bussed architecture and thin-film construction make it a standout choice for engineers prioritizing signal integrity and board-space optimization in non-automotive applications. While not RoHS-compliant, its performance in industrial and commercial systems justifies its niche for legacy or specialized designs.

FAQ

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The standard lead time for GS4B022321JDT is 30 weeks.
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