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GS4B022610GGT
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GS4B022610GGT Description
GS4B022610GGT Description
The GS4B022610GGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable resistance values under varying thermal conditions. Encased in a ceramic substrate, this thin-film resistor network offers a 261Ω resistance per element with a tight ±2% absolute tolerance and ±2% ratio tolerance, ensuring consistent performance in matched circuits. Its ±50ppm/°C temperature coefficient minimizes resistance drift across the -70°C to +125°C operating range, while the 0.4W total power rating (0.05W per resistor) supports robust operation in compact designs. The 100V maximum voltage rating and gull-wing termination make it suitable for automated PCB assembly.
GS4B022610GGT Features
- Ceramic Construction: Enhances thermal stability and durability in harsh environments.
- Bussed Network: Simplifies circuit design by connecting resistors in a common bus configuration.
- Precision Thin Film: Delivers low noise and high accuracy (±2% tolerance) for signal conditioning.
- Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power up to 125°C.
- Compact SOIC Package: 4.9mm × 5.99mm × 1.45mm dimensions with 1.27mm pitch, ideal for space-constrained PCBs.
- Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications where PPAP compliance is not required.
GS4B022610GGT Applications
- Voltage Dividers: Precision ratio matching in sensor interfaces or ADC reference circuits.
- Signal Termination: Impedance matching in high-speed data lines (e.g., LVDS, USB).
- Industrial Controls: Stable performance in PLCs, motor drives, and power management systems.
- Test & Measurement Equipment: Low-drift resistance networks for calibration and feedback loops.
- Consumer Electronics: Compact power distribution in set-top boxes or audio amplifiers.
Conclusion of GS4B022610GGT
The GS4B022610GGT excels in applications demanding tight tolerance, thermal stability, and compact footprint. Its ceramic thin-film technology and bussed design reduce component count while ensuring reliability in industrial and telecom systems. Though not RoHS-compliant or automotive-grade, it offers a cost-effective solution for precision analog circuits where environmental stressors are moderate. Engineers will appreciate its balance of performance, size, and ease of integration in surface-mount designs.



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